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LeadFREE  PCB
Development
Roadmap
Other Attributes
 
Rigid Lead Free Technology Roadmap, Year 2014 / 2015 / 2016
2014 2015 2016
 Max panel Size 23.5" x 20" 23.5" x 20" 24" x 22.5"
 Layer 1~16 1~16 1~20
 Hole Diameter 0.15mm 0.15mm 0.15mm
 Blind/Buried Via 0.05mm 0.05mm 0.05mm
 Aspect ratio 8:1 10:1 10:1
 Thin Core Thickness 0.05mm 0.05mm 0.05mm
 Min Line Width/Space 0.076/0.076mm 0.076/0.076mm 0.076/0.076mm
 Surface Finishing Electrolytic Gold Electrolytic Gold Electrolytic Gold
Entek Entek Entek
Immersion Gold Immersion Gold Immersion Gold
Lead Free HAL Lead Free HAL Lead Free HAL
 Green Laminate Mass Production Mass Production Mass Production
 Inner Layer Base Copper 3 oz 3 oz 4 oz
 Outer Layer Copper 6 oz 6 oz 6 oz
 LaminateTg 135; 150; 170°C;
180; 280
135; 150; 170°C;
180; 280
135; 150; 170°C;
180; 280

 

FPC Technology Roadmap, Year 2014 / 2015 / 2016

2014 2015 2016
 Max panel Size 11.8" x 15.7" 11.8" x 23.6" 11.8" x 23.6"
 Layer 1~4 1~4 1~4
 Hole Diameter 0.2mm 0.15mm 0.15mm
 Thin Core Thickness 0.05mm 0.05mm 0.05mm
 Min Line Width/Space 0.076/0.076mm 0.076/0.076mm 0.076/0.076mm
 Surface Finishing Entek Entek Entek
Immersion Gold Immersion Gold Immersion Gold
 Copper Thickness upto 2 oz upto 2 oz upto 2 oz

 

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