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LeadFREE  PCB
Development
Roadmap
Other Attributes
 
Other Attributes on Lead Free PCB
Attribute Immersion Silver ENIG OSP Electrolytic Gold Lead Free HAL Immersion Tin
Shelf Life (months) 3 6 6 6 6 3
Multiple Reflow 3 3+ 4+ 4 4 3
Process Temp. 50°C 80°C 40°C 70°C 260°C 50°C
Thickness 0.2 μm 0.03 μm 0.2 μm 0.03 μm 5-12 μm 0.8 μm
Hold Time Constraints Growth of inter-metallic Oxidation of Ni Oxidation of Ni Oxidation of Ni N/A Tin Whisker
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